Altus Group has marked the successful completion of Factory of the Future 2026, which brought electronics manufacturers, technology specialists and equipment suppliers together for three days of live demonstrations, technical presentations and manufacturing discussions.

Hosted by EMPEL Systems, this year’s event was the first to take place within a customer’s manufacturing facility. The new setting gave over 250 visitors the opportunity to see advanced production technologies demonstrated in a live environment and discuss their manufacturing requirements directly with industry specialists.

Joe Booth, CEO of Altus Group, said: “The response to Factory of the Future 2026 has been extremely positive. Bringing the event into a customer manufacturing facility gave visitors the opportunity to see the technologies in a practical setting and understand how they can work together across the complete production process.

“We wanted the event to provide more than equipment demonstrations. It gave manufacturers direct access to specialists, the opportunity to discuss their production challenges and useful information to support future investment decisions.

“I would like to thank EMPEL Systems for hosting the event, Fuji and all our technology partners for their support, and everyone who attended and contributed to such a successful three days.”

The event showcased solutions covering the complete electronics assembly process, from SMT and through-hole production to back-end processes, component management, inspection, traceability and consumables.

Visitors to the Altus event were able to see an advanced SMT line alongside equipment and technologies from a wide range of industry suppliers. Live demonstrations, hands-on sessions and factory tours provided a closer look at how these solutions can work together to support quality, efficiency and process control.

More than 25 presentations took place across the three days, with each day concentrating on a different area of electronics manufacturing, including, SMT assembly, through-hole manufacturing, back-end processes and component management.

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